New metal foam aims to tackle ‘dire’ energy problem at data centres

Heat is a major issue, this new process, dissipates it from chips quickly.
A very important breakthrough, that is game changer.

The thinner the wires, the faster the heat transfer since the heat does not get spread out until the heat gradient is too flat to enable transfer.

But thin wires also cannot hold as much heat than thick wires, like those in Edison lightbulb’s filaments cannot take in too much wattage before melting as opposed to thick wires that can.

So the wires needs to be perfect for the amount of heat it will need to transfer, with thinner ones to be used on slower heat production and thicker ones to be used on faster heat production so there is no one size fits all.